DDR2 PCB设计规则
采用单片16bit,1Gb内存颗粒,参考型号为MT47H64M16(1Gb)
16bit DDR2内存芯片管脚布局图
DDR2与FPGA的信号连接关系如下表(采用单端DQS信号):
DDR2 and FPGA pinout table
No. |
DDR2 Signal |
说明 |
DDR2 Pin |
FPGA End |
DDR2 End |
I/O Standard |
EP4CE40F23C8 Pin |
|
DDR2A_CK |
|
|
N/A |
100Om Diff |
Class I 12mA |
BANK3、U7 |
|
DDR2A_CK# |
|
|
N/A |
BANK3、U8 |
||
|
DDR2A_CS# |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、V14 |
|
DDR2A_CKE |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、W8 |
|
DDR2A_ODT |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AB16 |
|
DDR2A_RAS# |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、W15 |
|
DDR2A_CAS# |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AA16 |
|
DDR2A_WE# |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、V10 |
|
DDR2A_A0 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、Y17 |
|
DDR2A_A1 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、Y6 |
|
DDR2A_A2 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AB17 |
|
DDR2A_A3 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、AA4 |
|
DDR2A_A4 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AA17 |
|
DDR2A_A5 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、AA5 |
|
DDR2A_A6 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AB18 |
|
DDR2A_A7 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、AB3 |
|
DDR2A_A8 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、W17 |
|
DDR2A_A9 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、Y3 |
|
DDR2A_A10 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、AB5 |
|
DDR2A_A11 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK4、AB20 |
|
DDR2A_A12 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、AA3 |
|
DDR2A_BA0 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、V8 |
|
DDR2A_BA1 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、U9 |
|
DDR2A_BA2 |
|
|
N/A |
56Om to Vtt |
Class I 12mA |
BANK3、Y7 |
|
DDR2A_DQS0 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AB9 |
|
DDR2A_DM0 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA7 |
|
DDR2A_DQ0 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、Y10 |
|
DDR2A_DQ1 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA8 |
|
DDR2A_DQ2 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA9 |
|
DDR2A_DQ3 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、Y8 |
|
DDR2A_DQ4 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、W10 |
|
DDR2A_DQ5 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、U10 |
|
DDR2A_DQ6 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AB8 |
|
DDR2A_DQ7 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、V11 |
|
DDR2A_DQS1 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK4、Y13 |
|
DDR2A_DM1 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA10 |
|
DDR2A_DQ8 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AB15 |
|
DDR2A_DQ9 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、W13 |
|
DDR2A_DQ10 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AB14 |
|
DDR2A_DQ11 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AB13 |
|
DDR2A_DQ12 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA13 |
|
DDR2A_DQ13 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA15 |
|
DDR2A_DQ14 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、U12 |
|
DDR2A_DQ15 |
|
|
50Om to Vtt |
ODT75 |
Class I 12mA |
BANK3、AA14 |
|
RUP |
|
|
|
|
|
RUP2, AA19, BANK4 |
|
RDN |
|
|
|
|
|
RDN2, AB19, BANK4 |
DDR2 PCB设计规则:
- 地址、命令、控制、数据信号皆为点到点连接;
- 信号分组:数据组、地址/命令组、控制组、时钟组;
- 单端信号线阻抗控制在50om,差分信号线阻抗控制在100om,蛇形走线平行两线间距25mil以上;
- 数据组分成2组(每组包括DQ[ ]、DQM、DQS、10个信号),同一组DQS、DM、DQ布线在同一信号平面;数据组与非数据组信号间距25mil以上,组间信号间距10mil以上;数组组内信号参考DQS等长,等长误差+/-10mil以内;
- CLK差分对等长误差+/-5mil以内,不同CLK差分对等长误差20mil以内。差分对内间距10mil以下,不同差分对间距25mil以上。DQS与CLK等长误差+/-100mil以内;
- 地址/命令/控制组线径关于CLK等长,等长误差+/-100mil以内,与其他组信号间隔25mil以上,组内间隔10mil以上;
- 布线遵行3W原则,尽量保证所有信号长度小于5cm;
- 各组信号尽量分开,避免干扰;
- Vref布线宽度至少25mil,每个Vref管脚附近放置一个0.1uf电容;
- Vtt采用隔离覆铜,覆铜块两端至少放置一个4.7uF和220uF的块电容;